On yield consideration for the design of redundant programmable logic arrays
DAC '87 Proceedings of the 24th ACM/IEEE Design Automation Conference
Design-for-testability of PLA's using statistical cooling
DAC '86 Proceedings of the 23rd ACM/IEEE Design Automation Conference
Logic Minimization Algorithms for VLSI Synthesis
Logic Minimization Algorithms for VLSI Synthesis
Techniques for programmable logic array folding
DAC '82 Proceedings of the 19th Design Automation Conference
On the Design of High-Yield Reconfigurable PLA's
IEEE Transactions on Computers
Fault Diagnosis and Spare Allocation for Yield Enhancement in Large Reconfigurable PLAs
IEEE Transactions on Computers
The Hyeti Defect Tolerant Microprocessor: A Practical Experiment and its Cost-Effectiveness Analysis
IEEE Transactions on Computers
Proceedings of the Conference on Design, Automation and Test in Europe
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This paper presents a defect-tolerant and fully testable PLA allowing for the repair of a defective chip. The repair process is described. Special emphasis is devoted to the location of defects inside a PLA. The defect location mechanism is completely topological and circuit independent and therefore easy to adapt to existing PLA generators. Yield considerations for this type of PLAs are presented.