Novel optical probing technique for flip chip packaged microprocessors

  • Authors:
  • Mario Paniccia;Travis Eiles;V. R. M. Rao;Wai Mun Yee

  • Affiliations:
  • -;-;-;-

  • Venue:
  • ITC '98 Proceedings of the 1998 IEEE International Test Conference
  • Year:
  • 1998

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Abstract

A novel Infra-Red (IR) optical probing technique whichprovides fast and direct access to diffusion (p-n junction)nodes directly through the silicon substrate is described.The optical probing technology allows waveformmeasurements to be obtained directly from internal nodesof a CMOS integrated circuit (IC). These measurementscan be made on C4 (Flip Chip) mounted IC's in stand-alone,MCM or any other package type for which the chipbackside is accessible and the silicon substrate can bethinned. Timing waveforms taken from state of the artIntelmicroprocessors running at core frequencies 400MHzusing this IR probing technique have been obtained and arepresented.