Delta Iddq for Testing Reliability

  • Authors:
  • Theo J. Powell;James Pair;Melissa St. John;Doug Counce

  • Affiliations:
  • -;-;-;-

  • Venue:
  • VTS '00 Proceedings of the 18th IEEE VLSI Test Symposium
  • Year:
  • 2000

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Abstract

Point defects, which cause small current increases and increased chip background currents at elevated temperatures can mask potentially early failures. The difficulty of screening point defects will likely also occur in denser geometries. Delta Iddq is shown to help distinguish between early fail and reliable chips at these elevated temperatures. Memory application demonstrates that a variety of delta Iddq tests can screen early fail defects.