Studies of the SEMATECH IDDq test data
Journal of Systems Architecture: the EUROMICRO Journal - Defect and fault tolerance in VLSI Systems
Divide-and-Conquer IDDQ Testing for Core-based System Chips
ASP-DAC '02 Proceedings of the 2002 Asia and South Pacific Design Automation Conference
New Graphical IDDQ Signatures Reduce Defect Level and Yield Loss
VLSID '03 Proceedings of the 16th International Conference on VLSI Design
On the Comparison of IDDQ and IDDQ Testing
VTS '99 Proceedings of the 1999 17TH IEEE VLSI Test Symposium
Current Ratios: A Self-Scaling Technique for Production IDDQ Testing
ITC '00 Proceedings of the 2000 IEEE International Test Conference
Increasing the IDDQ Test Resolution Using Current Prediction
ITC '00 Proceedings of the 2000 IEEE International Test Conference
An Evaluation of Defect-Oriented Test: WELL-controlled Low Voltage Test
ITC '01 Proceedings of the 2001 IEEE International Test Conference
APPLICATION AND ANALYSIS OF IDDQ DIAGNOSTIC SOFTWARE
ITC '97 Proceedings of the 1997 IEEE International Test Conference
Current Signatures: Application
ITC '97 Proceedings of the 1997 IEEE International Test Conference
IDDQ Characterization in Submicron CMOS
ITC '97 Proceedings of the 1997 IEEE International Test Conference
Current Signatures: Application
ITC '98 Proceedings of the 1998 IEEE International Test Conference
An Histogram Based Procedure for Current Testing of Active Defects
ITC '99 Proceedings of the 1999 IEEE International Test Conference
Current Ratios: A Self-Scaling Technique for Production IDDQ Testing
ITC '99 Proceedings of the 1999 IEEE International Test Conference
FPGA Bridging Fault Detection and Location via Differential I{DDQ}
VTS '04 Proceedings of the 22nd IEEE VLSI Test Symposium
IDDX-based test methods: A survey
ACM Transactions on Design Automation of Electronic Systems (TODAES)
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The concept of the current signature has been proposed as a means for improving testing resolution over single-threshold IDDQ testing. This paper postulates a practical methodology for applying the current signature concept for die selection in a production environment.