Understanding Yield Losses in Logic Circuits

  • Authors:
  • D. Appello;A. Fudoli;K. Giarda;V. Tancorre;E. Gizdarski;B. Mathew

  • Affiliations:
  • STM Electron., Cornaredo, Italy;-;-;-;-;-

  • Venue:
  • IEEE Design & Test
  • Year:
  • 2004

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Abstract

Yield improvement requires understanding failures and identifying potential sources of yield loss. This article focuses on diagnosing random logic circuits and classifying faults. The authors introduce an interesting scan-based diagnosis flow, which leverages the ATPG patterns originally generated for fault coverage. This flow shows an adequate link between the design automation tools and the testers, and a correlation between the ATPG patterns and the tester failure reports.