Impact of interconnect variations on the clock skew of a gigahertz microprocessor
Proceedings of the 37th Annual Design Automation Conference
First-order incremental block-based statistical timing analysis
Proceedings of the 41st annual Design Automation Conference
Block-based Static Timing Analysis with Uncertainty
Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
Statistical Timing Analysis Considering Spatial Correlations using a Single Pert-Like Traversal
Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
Statistical Timing Analysis for Intra-Die Process Variations with Spatial Correlations
Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
Testing On-Die Process Variation in Nanometer VLSI
IEEE Design & Test
System-on-Chip Test Architectures: Nanometer Design for Testability
System-on-Chip Test Architectures: Nanometer Design for Testability
| Hi-index | 0.00 |
Statistical Static Timing Analysis (SSTA) tools have mostly addressed the process variations of devices and lumped interconnect RC effects. This paper provides an overview of interconnect process variations of capacitive coupling and its effect on crosstalk delay and noise. The correlations among parallel plate, lateral and total capacitance is shown. Correlations between resistance and capacitance are illustrated to enable development of a simple and efficient model for delay and noise analysis. Experimental results are shown to validate the assumptions on the linearity of sensitivity of delay and noise to process variations. A methodology to account for process variations in crosstalk delay and noise is proposed.