Parallel cross-layer optimization of high-level synthesis and physical design

  • Authors:
  • James Williamson;Yinghai Lu;Li Shang;Hai Zhou;Xuan Zeng

  • Affiliations:
  • ECEE, University of Colorado, Boulder;EECS, Northwestern University;ECEE, University of Colorado, Boulder;EECS, Northwestern University and Fudan University, China;Fudan University, China

  • Venue:
  • Proceedings of the 16th Asia and South Pacific Design Automation Conference
  • Year:
  • 2011

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Abstract

Integrated circuit (IC) design automation has traditionally followed a hierarchical approach. Modern IC design flow is divided into sequentially-addressed design and optimization layers; each successively finer in design detail and data granularity while increasing in computational complexity. Eventual agreement across the design layers signals design closure. Obtaining design closure is a continual problem, as lack of awareness and interaction between layers often results in multiple design flow iterations. In this work, we propose parallel cross-layer optimization, in which the boundaries between design layers are broken, allowing for a more informed and efficient exploration of the design space. We leverage the heterogeneous parallel computational power in current and upcoming multi-core/many-core computation platforms to suite the heterogeneous characteristics of multiple design layers. Specifically, we unify the highlevel and physical synthesis design layers for parallel cross-layer IC design optimization. In addition, we introduce a massively-parallel GPU floorplanner with local and global convergence test as the proposed physical synthesis design layer. Our results show average performance gains of 11X speed-up over state-of-the-art.