A framework for architecture-level power, area, and thermal simulation and its application to network-on-chip design exploration

Authors:
Ming-yu Hsieh;Arun Rodrigues;Rolf Riesen;Kevin Thompson;William Song
Affiliations:
Sandia National Laboratories, NM, USA;Sandia National Laboratories, NM, USA;Sandia National Laboratories, NM, USA;New Mexico State University, NM, USA;Georgia Institute of Technology, GA, USA
Venue:
ACM SIGMETRICS Performance Evaluation Review - Special issue on the 1st international workshop on performance modeling, benchmarking and simulation of high performance computing systems (PMBS 10)
Year:
2011

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Abstract

We describe the integrated power, area and thermal modeling framework in the Structural Simulation Toolkit (SST) for large-scale high performance computer simulation. It integrates various power and thermal modeling tools and computes run-time energy dissipation for core, network on chip, memory controller and shared cache. It also has functionality to update the leakage power as temperature changes. We illustrate the utilization of the framework by applying it to explore interconnect options in manycore systems with consideration of temperature variation and leakage feedback. We compare power, energy-delay-area product (EDAP), and energy-delay product (EDP) of four manycore configurations-1 core, 2 cores, 4 cores and 8 cores per cluster. Results from simulation with or without consideration of temperature variation both show that the 4-core per cluster configuration has the best EDAP and EDP. Even so, considering temperature variation increases total power dissipation. We demonstrate the importance of considering temperature variation in the design ow. With this power, area and thermal modeling capability, SST can be used for hardware/software co-design of future Exascale systems.