Kendall's advanced theory of statistics
Kendall's advanced theory of statistics
Parallel Preconditioning with Sparse Approximate Inverses
SIAM Journal on Scientific Computing
Full chip leakage estimation considering power supply and temperature variations
Proceedings of the 2003 international symposium on Low power electronics and design
Dynamic Thermal Management for High-Performance Microprocessors
HPCA '01 Proceedings of the 7th International Symposium on High-Performance Computer Architecture
Block-based Static Timing Analysis with Uncertainty
Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
Proceedings of the 2004 international symposium on Low power electronics and design
Scaling Analysis of On-Chip Power Grid Voltage Variations in Nanometer Scale ULSI
Analog Integrated Circuits and Signal Processing
Power grid voltage integrity verification
ISLPED '05 Proceedings of the 2005 international symposium on Low power electronics and design
Statistical delay computation considering spatial correlations
ASP-DAC '03 Proceedings of the 2003 Asia and South Pacific Design Automation Conference
Thermal Trends in Emerging Technologies
ISQED '06 Proceedings of the 7th International Symposium on Quality Electronic Design
Introduction to Probability Models, Ninth Edition
Introduction to Probability Models, Ninth Edition
Prediction of leakage power under process uncertainties
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Power grid analysis benchmarks
Proceedings of the 2008 Asia and South Pacific Design Automation Conference
Thermal-Aware IR Drop Analysis in Large Power Grid
ISQED '08 Proceedings of the 9th international symposium on Quality Electronic Design
Impact of Process and Temperature Variations on Network-on-Chip Design Exploration
NOCS '08 Proceedings of the Second ACM/IEEE International Symposium on Networks-on-Chip
Fast vectorless power grid verification using an approximate inverse technique
Proceedings of the 46th Annual Design Automation Conference
Hotspot: acompact thermal modeling methodology for early-stage VLSI design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Early-stage power grid analysis for uncertain working modes
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Analysis and verification of power grids considering process-induced leakage-current variations
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Statistical Thermal Profile Considering Process Variations: Analysis and Applications
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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Process variations significantly impact leakage power, a pivotal parameter in designing a power grid. Because of the strong relationship between temperature and leakage power, the variations also impose statistical behavior on the operating temperature. In addition, the metal resistivity of a power grid increases with temperature. Therefore, ignoring the interdependency between leakage and temperature can introduce large errors in the power grid design. In this paper, a power grid analysis is proposed considering a statistical thermal profile across the grid. In addition, an efficient verification method is provided that ensures the robustness of the power grid in the presence of variations. A reliable estimation of the statistical thermal profile at the architecture level makes it possible to address any voltage violation early in the design process.