Lithography-aware layout compaction

  • Authors:
  • Curtis Andrus;Matthew R. Guthaus

  • Affiliations:
  • University of California, Santa Cruz, Santa Cruz, CA, USA;University of California, Santa Cruz, Santa Cruz, CA, USA

  • Venue:
  • Proceedings of the great lakes symposium on VLSI
  • Year:
  • 2012

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Abstract

Optical Proximity Correction (OPC) tools can suffer if the origi- nal layout is inherently difficult to print. Most routing techniques are unaware of the lithographic process, but several have been proposed to make the layout easier for the OPC tool to correct. This paper proposes a generalized preprocess step for OPC that uses a modified 1D layout compactor to expand or shrink geometry to decrease the amount of OPC work needed. This lithography-aware compactor estimates the OPC effort required and then uses a non-linear formulation to adjust the layout geometry. We describe a method for performing this compaction on small layouts and then extend it to handle larger hierarchical standard cell layouts.