Capturing post-silicon variation by layout-aware path-delay testing

  • Authors:
  • Xiaolin Zhang;Jing Ye;Yu Hu;Xiaowei Li

  • Affiliations:
  • Chinese Academy of Sciences and University of Chinese Academy of Sciences;Chinese Academy of Sciences and University of Chinese Academy of Sciences;Chinese Academy of Sciences;Chinese Academy of Sciences

  • Venue:
  • Proceedings of the Conference on Design, Automation and Test in Europe
  • Year:
  • 2013

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Abstract

With aggressive device scaling, the impact of parameter variation is becoming more prominent, which results in the uncertainty of a chip's performance. Techniques that capture post-silicon variation by deploying on-chip monitors suffer from serious area overhead and low testing reliability, while techniques using non-invasion test are limited in small scale circuits. In this paper, a novel layout-aware post-silicon variation extraction method which is based on non-invasive path-delay test is proposed. The key technique of the proposed method is a novel layout-aware heuristic path selection algorithm which takes the spatial correlation and linear dependence between paths into consideration. Experimental results show that the proposed technique can obtain an accurate timing variation distribution with zero area overhead. Moreover, the test cost is much smaller than the existing non-invasion method.