Digital integrated circuits: a design perspective
Digital integrated circuits: a design perspective
Performance optimization of VLSI interconnect layout
Integration, the VLSI Journal
Interconnect design for deep submicron ICs
ICCAD '97 Proceedings of the 1997 IEEE/ACM international conference on Computer-aided design
Gate-level power and current simulation of CMOS integrated circuits
IEEE Transactions on Very Large Scale Integration (VLSI) Systems - Special issue on low power electronics and design
Low-string on-chip signaling techniques: effectiveness and robustness
IEEE Transactions on Very Large Scale Integration (VLSI) Systems - Special section on low-power electronics and design
Quantitative study of the impact of design and synthesis options on processor core performance
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
SimpleFit: A Framework for Analyzing Design Trade-Offs in Raw Architectures
IEEE Transactions on Parallel and Distributed Systems
Efficient exploration of the SoC communication architecture design space
Proceedings of the 2000 IEEE/ACM international conference on Computer-aided design
Interconnect performance estimation models for design planning
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Delay and Power Estimation Models of Low-Swing Interconnects for Design Planning
GLSVLSI '06 Proceedings of the 16th ACM Great Lakes symposium on VLSI
Proceedings of the Conference on Design, Automation and Test in Europe
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The impact of global on-chip interconnections on power consumption and speed of integrated circuits is becoming a serious concern. Designers need therefore to quickly estimate how performance and power are affected by a given choice of the interconnection parameters (length, voltage swing, driver and receiver schematics and sizing). This work focuses on the entire communication channel (driver, interconnect, receiver), and provides high level parametric VHDL simulation models for low-swing signaling schemes. These SPICE-derived power and timing macromodels transfer electrical-level information to the RTL simulation in an event-driven fashion, as transitions occur at the input of the interconnect driver. The accuracy reached by this back-annotation technique is within 5% with respect to SPICE results, with only 4% simulation speed penalty in the worst case.