Practical considerations in RLCK crosstalk analysis for digital integrated circuits

  • Authors:
  • Steven C. Chan;K. L. Shepard

  • Affiliations:
  • Cadence Design Systems, Inc, San Jose, CA;Columbia University, New York, NY

  • Venue:
  • Proceedings of the 2001 IEEE/ACM international conference on Computer-aided design
  • Year:
  • 2001

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Abstract

Inductance and inductive crosstalk has become an important new concern for on-chip wires in deep-submicron integrated circuits. Recent advances in extractors to include inductance make possible the extraction of coupled RLCK interconnect networks from large, complex on-chip layouts. In this paper, we describe the techniques we use in a commercial static noise analysis tool to analyze crosstalk noise due to fully-coupled RLCK networks extracted from layout. Notable are the approaches we use to filter and lump aggressor couplings, as well as the techniques used to handle degeneracies in the modified nodel analysis (MNA) formulation. Furthermore, the nonmonotonicity of interconnect responses in the presence of inductance require additional "sensitizations" in searching the possible switching events inducing the worst-case noise. Comparisons with silicon indicate the need to include the substrate in the extracted models in certain cases.