Transition density, a stochastic measure of activity in digital circuits
DAC '91 Proceedings of the 28th ACM/IEEE Design Automation Conference
Circuit design for CMOS VLSI
On the OBDD-Representation of General Boolean Functions
IEEE Transactions on Computers
Estimation of average switching activity in combinational and sequential circuits
DAC '92 Proceedings of the 29th ACM/IEEE Design Automation Conference
Technology decomposition and mapping targeting low power dissipation
DAC '93 Proceedings of the 30th international Design Automation Conference
EURO-DAC '94 Proceedings of the conference on European design automation
Pattern-independent current estimation for reliability analysis of CMOS circuits
DAC '88 Proceedings of the 25th ACM/IEEE Design Automation Conference
A Switch-Level Model and Simulator for MOS Digital Systems
IEEE Transactions on Computers
Hot-carrier reliability enhancement via input reordering and transistor sizing
DAC '96 Proceedings of the 33rd annual Design Automation Conference
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Long-term reliability of MOS VLSI circuits is becoming an important issue with rapid advances in VLSI technology and increasing VLSI chip densities. Hot-carrier effects and electromigration are the two important failure mechanisms that significantly impact the long-term reliability of high-density VLSI ICs. In this paper, we present a probabilistic switch-level method for identifying MOSFETs in the circuit that are most susceptible to hot-carrier effects. Subsequently, we outline two techniques-(i) reordering of inputs to logic gates and (ii) selective MOSFET siting-to reduce the hot-carrier susceptibility of these critical MOSFETs. Finally, we show that for a given circuit, the best design in terms of hot-carrier reliability does not necessarily coincide with the best design in terms of power consumption. The algorithms are incorporated into SIS and are evaluated on the ISCAS-MCNC91 benchmark suite.