IEEE Transactions on Very Large Scale Integration (VLSI) Systems - Special section on low power
Larger-than-vdd forward body bias in sub-0.5V nanoscale CMOS
Proceedings of the 2004 international symposium on Low power electronics and design
Electrothermal analysis and optimization techniques for nanoscale integrated circuits
ASP-DAC '06 Proceedings of the 2006 Asia and South Pacific Design Automation Conference
Confidence scalable post-silicon statistical delay prediction under process variations
Proceedings of the 44th annual Design Automation Conference
Performance-Optimized Design for Parametric Reliability
Journal of Electronic Testing: Theory and Applications
NBTI resilient circuits using adaptive body biasing
Proceedings of the 18th ACM Great Lakes symposium on VLSI
A framework for scalable postsilicon statistical delay prediction under process variations
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
MODEST: a model for energy estimation under spatio-temporal variability
Proceedings of the 16th ACM/IEEE international symposium on Low power electronics and design
Physically clustered forward body biasing for variability compensation in nanometer CMOS design
Proceedings of the Conference on Design, Automation and Test in Europe
Row-based FBB: A design-time optimization for post-silicon tunable circuits
Microelectronics Journal
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Process variations and temperature variations can cause both the frequency and the leakage of the chip to vary significantly from their expected values, thereby decreasing the yield. Adaptive Body Bias (ABB) can be used to pull back the chip to the nominal operational region. We propose the use of this technique to counter temperature variations along with process variations. We present a CAD perspective for achieving process and temperature compensation using bidirectional ABB. Mathematical models are used to determine the exact amount of body bias required to optimize the delay and leakage, and an algorithmic flow that can be adopted for gigascale LSI systems is provided.