Multi-bend bus-driven floorplanning considering fixed-outline constraints

  • Authors:
  • Wenxu Sheng;Sheqin Dong

  • Affiliations:
  • EDA Lab, Department of Computer Science & Technology, Tsinghua University, China;EDA Lab, Department of Computer Science & Technology, Tsinghua University, China

  • Venue:
  • Integration, the VLSI Journal
  • Year:
  • 2013

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Abstract

The rapid rate of technological advances makes it necessary for very large scale integration (VLSI) floorplanning to consider not only interconnect constraints, but also fixed-outline constraints. In this paper, we propose a new approach to address the problem of Bus-Driven Floorplanning (BDF) within a fixed die. By providing the width and height of a chip, a set of circuit blocks and the bus specifications (i.e., the width of each bus and the blocks that the bus needs to go through), the approach will generate a final floorplan that satisfies the following requirements: (a) all blocks are packed within the fixed outline, (b) all buses are routable and (c) the floorplan area and total bus area are minimized. Based on the deterministic algorithm Less Flexibility First (LFF), our approach does not need to resort to a floorplan representation and functions very well in fixed-outline floorplanning. Our approach places no limitations on the shape of the buses, and the processes of block packing and bus packing proceed simultaneously. According to the experimental results, our approach can generate a good solution with a lower percentage of dead space, a shorter total length of all buses and a shorter run time, even under fixed-outline constraints. In addition, our algorithm works well for large and complex test cases that have not been studied in previous research.