Integrated floorplanning with buffer/channel insertion for bus-based microprocessor designs

  • Authors:
  • Faran Rafiq;Malgorzata Chrzanowska-Jeske;Hannah Honghua Yang;Naveed Sherwani

  • Affiliations:
  • Intel Microlectronics, Beaverton, OR;ECE Portland State University, Portland, OR;Intel Corporation, Hillsboro, OR;Intel Microlectronics, Beaverton, OR

  • Venue:
  • Proceedings of the 2002 international symposium on Physical design
  • Year:
  • 2002

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Abstract

A new approach to the interconnect-driven floorplanning problem that integrates bus planning with floorplanning is presented. The integrated floorplanner is intended for bus-based designs. Each bus consists of a large number of wires. The floorplanner ensures routability by generating the exact location and shape of interconnects (above and between the circuit blocks) and optimizes the timing. Experiments with MCNC benchmarks clearly show the superiority of integrated floorplanning over the classical floorplan-analyze-and-then-re-floorplan approach. Our floorplans are routable, meet all timing constraints, and are on average 12-13% smaller in area as compared to the traditional floorplanning algorithms.