Analytical models and algorithms for the efficient signal integrity verification of inductance-effect-prominent multicoupled VLSI circuit interconnects

Authors:
Seongkyun Shin;Yungseon Eo;William R. Eisenstadt;Jongin Shim
Affiliations:
Department of Electrical and Computer Engineering, Hanyang University, Seoul 425-791, South Korea;Department of Electrical and Computer Engineering, Hanyang University, Seoul 425-791, South Korea;Department of Electrical and Computer Engineering, University of Florida, Gainesville, FL;Department of Electrical and Computer Engineering, Hanyang University, Seoul 425-791, South Korea
Venue:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Year:
2004

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Abstract

Novel signal integrity verification models and algorithms for inductance-effect- prominent RLC interconnect lines are developed by using a traveling-wave-based waveform approximation (TWA) technique. The multicoupled line responses are decoupied into the eigenmodes of the system in order to exploit the TWA technique. Then, the response signals are mathematically represented by the linear combination of each eigenmode response based on TWA, followed by reporting the signal integrity models and algorithms for the multicoupled lines. The signal integrity of VLSI circuit interconnects is complicatedly correlated with input signal switching-patterns, layout geometry, and termination conditions. It is shown that the technique can be efficiently employed for complicated multicoupled interconnect lines with various termination conditions and the signal transients based on the technique have excellent agreement with SPICE simulations. Thus, with the proposed technique, the switching-dependent signal delay, crosstalk, ringing, and glitches of the inductance-effect-prominent RLC interconnect lines can be accurately as well as efficiently determined.