Temperature-Aware Computer Systems: Opportunities and Challenges

  • Authors:
  • Kevin Skadron;Mircea R. Stan;Wei Huang;Sivakumar Velusamy;Karthik Sankaranarayanan;David Tarjan

  • Affiliations:
  • University of Virginia;University of Virginia;University of Virginia;University of Virginia;University of Virginia;University of Virginia

  • Venue:
  • IEEE Micro
  • Year:
  • 2003

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Abstract

Temperature-aware design techniques have an important role to play in addition to traditional techniques like power-aware design and package- and board-level thermal engineering. These authors define the role of architecture techniques and describe HotSpot, an accurate yet fast thermal model suitable for computer architecture research.