Flexible self-aligned double patterning aware detailed routing with prescribed layout planning

  • Authors:
  • Jhih-Rong Gao;David Z. Pan

  • Affiliations:
  • Dept. of ECE, The University of Texas at Austin, Austin, USA;Dept. of ECE, The University of Texas at Austin, Austin, USA

  • Venue:
  • Proceedings of the 2012 ACM international symposium on International Symposium on Physical Design
  • Year:
  • 2012

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Abstract

Self-aligned double patterning (SADP) is a promising manufacturing option for sub-22nm technology nodes. Studies have shown that SADP provides better overlay control than traditional litho-etch-litho-etch double patterning. However, the use of stitch is not allowed, which makes layout decomposition for SADP more difficult. It is necessary to find a new solution to handle pattern conflicts and consider SADP in earlier stages. In this paper, we propose a novel multi-layer SADP-aware detailed routing with prescribed layout planning. Our method is based on a correct-by-construction approach to take SADP compliancy into account during routing, and to achieve layout decomposition simultaneously. The experimental result shows that the proposed approach consistently achieves SADP-compliant solutions on both single-layer and multi-layer designs.