Scalable hierarchical floorplanning for fast physical prototyping of systems-on-chip

  • Authors:
  • Renshen Wang;Nimish Shah

  • Affiliations:
  • Mentor Graphics Corporation, Fremont, CA, USA;Mentor Graphics Corporation, Fremont, CA, USA

  • Venue:
  • Proceedings of the 2012 ACM international symposium on International Symposium on Physical Design
  • Year:
  • 2012

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Abstract

Floorplanning, as an early stage of the physical design flow, has been extensively studied in literature and developed into several branches. Recently, hierarchical floorplanning is regaining attention due to the rising scale of systems-on-chip, which necessarily requires divide-and-conquer strategies to handle the increasing complexity. This paper introduces a floorplanning scheme targeting hierarchical physical prototyping, answering some of the questions posed by Kahng [8] on classical floorplanning. Our scheme emphasizes practical requirements including runtime scalability, wire length and shape quality. We formulate a new hierarchical floorplanning problem with reduced computational complexity, but without weakening the problem as a global layout optimization. To achieve this goal, a placement seed is taken as input and converted into a slicing floorplan under the given constraints of region area and aspect ratio (region shape). We solve the problem by devising an efficient slicing algorithm with integrated dynamic programming. Implementation of the algorithm shows fast runtime and good quality of result.