A method for generating weighted random test pattern
IBM Journal of Research and Development
IBM Journal of Research and Development
Boundary-scan design principles for efficient LSSD ASIC testing
IBM Journal of Research and Development
Verity—a formal verification program for custom CMOS circuits
IBM Journal of Research and Development - Special issue: IBM CMOS technology
Advanced microprocessor test strategy and methodology
IBM Journal of Research and Development - Special issue: IBM S/390 G3 and G4
Testing the Enterprise IBM System/390TM Multi Processor
Proceedings of the IEEE International Test Conference
Testing the 400-MHz IBM Generation-4 CMOS Chip
Proceedings of the IEEE International Test Conference
A logic design structure for LSI testability
DAC '77 Proceedings of the 14th Design Automation Conference
Enhanced Reduced Pin-Count Test for Full-Scan Design
Journal of Electronic Testing: Theory and Applications
Enhanced Reduced Pin-Count Test for Full-Scan Design
ITC '01 Proceedings of the 2001 IEEE International Test Conference
Test-length and TAM optimization for wafer-level reduced pin-count testing of core-based SoCs
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Structural and functional test of IBM system z10 chips
IBM Journal of Research and Development
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This article describes the design-for-test framework of the 500MHz CMOS central processor (CP) used in the IBM Generation-5 S/390 ??line of servers. It will describe details of modeling logic to achieve correct and effective tests as well as describe the test sets required to test all portions of the design. This includes built-in self-test, array self-test, weighted random pattern generation, algorithmic pattern generation, and manual patterns. Tests are used to detect faults, static and dynamic, and to debug/ diagnose chip failures characteristic to the function under test. The described tests ensure the highest reliability for the components within the system. Some of the same test patterns are applied in chip manufacturing and in system level test. The tests developed for the 500MHz chip are very similar to those developed for the 400MHz Generation-4 S/390 chips.The improvements made to the test of the 500MHz chip were to run more patterns, and run them more efficiently in manufacturing. high quality standards but minimize test costs including minimizing dependencies on expensive test equipment. Tester time is minimized with an effective test pattern set while maintaining well over 99% stuck fault test coverage. Extensive testing begins at the wafer level, continues on a temporary single chip carrier, next to the MCM level and finally at the system level. The end result is a thoroughly tested, affordable, and highly diagnosable design.