Design methodology and tools for NEC electronics' structured ASIC ISSP

  • Authors:
  • Takumi Okamoto;Tsutomu Kimoto;Naotaka Maeda

  • Affiliations:
  • NEC Corporation, Kanagawa, Japan;NEC Electronics Corporation, Kanagawa, Japan;NEC Electronics Corporation, Kanagawa, Japan

  • Venue:
  • Proceedings of the 2004 international symposium on Physical design
  • Year:
  • 2004

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Abstract

In this paper, we describe a design methodology and tools for NEC Electronics' structured ASIC, Instant Silicon Solution Platform (ISSP), which is being developed to fill the gap between FPGAs and standard cell-based ASICs. The ISSP has a unique regular-fabric architecture designed to achieve both a short time to production and high-performance LSI design. We have developed a special design methodology and tools to fully exploit the capability of this new device. Experimental results for industrial data show that our approach has advantages for ISSP design.