On-Chip Self-Calibrating Communication Techniques Robust to Electrical Parameter Variations

  • Authors:
  • Frederic Worm;Paolo Ienne;Patrick Thiran;Giovanni De Micheli

  • Affiliations:
  • Swiss Federal Institute of Technology Lausanne;Swiss Federal Institute of Technology Lausanne;Swiss Federal Institute of Technology Lausanne;Stanford University

  • Venue:
  • IEEE Design & Test
  • Year:
  • 2004

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Abstract

Editor's note: Dynamic self-calibration holds the promise of overcoming conservative worst-case design techniques needed to combat deep-submicron process and operating variations. This article proposes an on-chip point-to-point interconnect scheme characterized by self-calibration that can operate dynamically to achieve the best energy/performance trade-off. 驴Soha Hassoun, Tufts University