Chip-planning, placement, and global routing of macro/custom cell integrated circuits using simulated annealing

  • Authors:
  • Carl Sechen

  • Affiliations:
  • Dept. of Electrical Engineering, Yale University, New Haven, CT

  • Venue:
  • DAC '88 Proceedings of the 25th ACM/IEEE Design Automation Conference
  • Year:
  • 1988

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Abstract

The algorithms and the implementation of a new macro/custom cell chip-planning, placement, and global routing package are presented. The simulated-annealing-based placement algorithm proceeds in two stages. In the first stage, the interconnect area around the individual cells is determined using a new dynamic interconnect area estimator. The second stage consists of: (1) a channel definition step, using a new channel definition algorithm, (2) a global routing step, using a new global router algorithm, and (3) a placement refinement step. This strategy has produced placements which require very little placement modification during detailed routing. Total interconnect length savings of 8 to 49 percent were achieved in experiments on 9 industrial circuits. Furthermore, circuit-area reductions ranged from 4 to 56 percent versus a variety of other placement methods.