A subjective review of compaction (tutorial session)
DAC '85 Proceedings of the 22nd ACM/IEEE Design Automation Conference
IC mask layout with a single conductor layer
DAC '70 Proceedings of the 7th Design Automation Workshop
A new compaction scheme based on compression ridges
DAC '87 Proceedings of the 24th ACM/IEEE Design Automation Conference
An efficient two-dimensional layout compaction algorithm
DAC '89 Proceedings of the 26th ACM/IEEE Design Automation Conference
An analytic optimization technique for placement of macro-cells
DAC '89 Proceedings of the 26th ACM/IEEE Design Automation Conference
An O(n1.5logn) 1-d compaction algorithm
DAC '90 Proceedings of the 27th ACM/IEEE Design Automation Conference
VLSI layout compaction using radix priority search trees
DAC '91 Proceedings of the 28th ACM/IEEE Design Automation Conference
A compaction algorithm for non-convex polygons and its application
SCG '93 Proceedings of the ninth annual symposium on Computational geometry
DAC '93 Proceedings of the 30th international Design Automation Conference
Symbolic layout compaction review
DAC '88 Proceedings of the 25th ACM/IEEE Design Automation Conference
An efficient compactor for 45° layout
DAC '88 Proceedings of the 25th ACM/IEEE Design Automation Conference
Highlight of VLSI at research Berkeley
ACM '86 Proceedings of 1986 ACM Fall joint computer conference
Adaptive Cluster Growth (ACG): a new algorithm for circuit packing in rectilinear region
EURO-DAC '90 Proceedings of the conference on European design automation
Two-Dimensional Layout Migration by Soft Constraint Satisfaction
ISQED '05 Proceedings of the 6th International Symposium on Quality of Electronic Design
Cell-based interconnect migration by hierarchical optimization
Integration, the VLSI Journal
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A new technique for 2-dimensional layout compaction of integrated circuits is presented. After a traditional one-dimentional precompaction step, the size of the layout is further reduced with a technique that bears a strong similarity to the technique of 'zone-refining' used in the purification of crystal ingots. Individual circuit components or small clusters of components are peeled off row by row from the precompacted layout, moved across an open zone, and reassembled at the other end of this zone in a denser configuration. In this process both coordinates of the moved components are altered and jogs are introduced in the connecting wires between them to produce the needed flexibility for placing components into optimal positions. The constraint graphs in both the x- and y-direction are used and updated concurrently.