The Y-Architecture for On-Chip Interconnect: Analysis and Methodology

  • Authors:
  • Hongyu Chen;Chung-Kuan Cheng;Andrew B. Kahng;Ion Mandoiu;Qinke Wang;Bo Yao

  • Affiliations:
  • University of California at San Diego, La Jolla;University of California at San Diego, La Jolla;University of California at San Diego, La Jolla;University of Connecticut, Storrs;University of California at San Diego, La Jolla;University of California at San Diego, La Jolla

  • Venue:
  • Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
  • Year:
  • 2003

Quantified Score

Hi-index 0.00

Visualization

Abstract

The Y-architecture for on-chip interconnect is based on pervasiveuse of 0-, 120-, and 240-degree oriented semi-global and globalwiring. Its use of three uniform directions exploits on-chip routingresources more efficiently than traditional Manhattan wiring architecture.This paper gives in-depth analysis of deployment issues associatedwith the Y-architecture. Our contributions are as follows:(1) We analyze communication capability (throughput of meshes)for different interconnect architectures using a multi-commodityflow approach and a Rentian communication model. Throughput ofthe Y-architecture is largely improved compared to the Manhattanarchitecture, and is close to the throughput of the X-architecture.(2) We propose a symmetrical Y clock tree structure with bettertotal wire length compared to both H and X clock tree structures,and better path length compared to the H tree. (3) We discuss powerdistribution under the Y-architecture, and give analytical and SPICEsimulation results showing that the power network in Y-architecturecan achieve 8.5% less IR drop than an equally-resourced power networkin Manhattan architecture. (4) We propose the use of via tunnelsand banks of via tunnels as a technique for improving routabilityfor Manhattan and Y-architectures.