Bus-invert coding for low-power I/O
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Reducing bus delay in submicron technology using coding
Proceedings of the 2001 Asia and South Pacific Design Automation Conference
Odd/even bus invert with two-phase transfer for buses with coupling
Proceedings of the 2002 international symposium on Low power electronics and design
Coupling-driven signal encoding scheme for low-power interface design
Proceedings of the 2000 IEEE/ACM international conference on Computer-aided design
Bus encoding to prevent crosstalk delay
Proceedings of the 2001 IEEE/ACM international conference on Computer-aided design
Analysis and Avoidance of Cross-Talk in On-Chip Buses
HOTI '01 Proceedings of the The Ninth Symposium on High Performance Interconnects
Interconnect modeling and optimization in deep sub-micron technologies
Interconnect modeling and optimization in deep sub-micron technologies
A Crosstalk Aware Interconnect with Variable Cycle Transmission
Proceedings of the conference on Design, automation and test in Europe - Volume 1
Shift Invert Coding (SINV) for Low Power VLSI
DSD '04 Proceedings of the Digital System Design, EUROMICRO Systems
Area and Energy-Efficient Crosstalk Avoidance Codes for On-Chip Buses
ICCD '04 Proceedings of the IEEE International Conference on Computer Design
VLSID '05 Proceedings of the 18th International Conference on VLSI Design held jointly with 4th International Conference on Embedded Systems Design
Delay and Energy Efficient Data Transmission for On-Chip Buses
ISVLSI '06 Proceedings of the IEEE Computer Society Annual Symposium on Emerging VLSI Technologies and Architectures
Bus encoding for simultaneous delay and energy optimization
Proceedings of the 13th international symposium on Low power electronics and design
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In deep-submicron (DSM) technology, shrinking wire size andreduced inter-wire spacing are leading to increased propagation delay of the on-chip interconnects. Various techniques, such as shielding and coding, etc., have been proposed to minimize this delay. This paper proposes a set of coding schemes (scheme 1, 2 and 3) to reduce the delay by incorporating spatial and temporal redundancy independently as well as combined. SPICE simulations are carried out for interconnect lines of different dimensions at various technology nodes (180, 130, 90 and 65 nm). Experimental results indicate that the proposed coding scheme-2 eliminates the crosstalk classes 4, 5 and 6, and reduces the delay by about 33-67% for 2, 5 and 10 mm lengthinterconnects.