Sequence-pair based placement method for hard/soft/pre-placed modules

  • Authors:
  • Hiroshi Murata;Ernest S. Kuh

  • Affiliations:
  • Department of Electrical Engineering and Computer Science, University of California, Berkeley;Department of Electrical Engineering and Computer Science, University of California, Berkeley

  • Venue:
  • ISPD '98 Proceedings of the 1998 international symposium on Physical design
  • Year:
  • 1998

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Abstract

This paper proposes a placement method for a mixed set of hard, soft, and pre-placed modules, based on a placement topology representation called sequence-pair. Under one sequence-pair, a convex optimization problem is efficiently formulated and solved to optimize the aspect ratios of the soft modules. The method is used in two ways: i) directly applied in simulated annealing to present the most exact placement method, ii) applied as a post process in an approximate placement method for faster computation. The performance of these two methods are reported using MCNC benchmark examples.