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Proceedings of the 1997 international symposium on Physical design
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VLSI module placement based on rectangle-packing by the sequence-pair
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ACM Transactions on Design Automation of Electronic Systems (TODAES)
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ACM Transactions on Design Automation of Electronic Systems (TODAES)
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Packing problems with soft rectangles
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This paper proposes a placement method for a mixed set of hard, soft, and pre-placed modules, based on a placement topology representation called sequence-pair. Under one sequence-pair, a convex optimization problem is efficiently formulated and solved to optimize the aspect ratios of the soft modules. The method is used in two ways: i) directly applied in simulated annealing to present the most exact placement method, ii) applied as a post process in an approximate placement method for faster computation. The performance of these two methods are reported using MCNC benchmark examples.