Improving bus test via IDDT and boundary scan

Authors:
Shih-Yu Yang;Christos A. Papachristou;Massood Tabib-Azar
Affiliations:
Intel Corporation, 5200 NE Elam Young Parkway, Hillsboro, OR;Case Western Reserve University, 10900 Euclid Avenue, Cleveland, OH;Case Western Reserve University, 10900 Euclid Avenue, Cleveland, OH
Venue:
Proceedings of the 38th annual Design Automation Conference
Year:
2001

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Abstract

This paper presents a systematic test methodology targeting bus line interconnect defects using IDDT testing and Boundary Scan. Traditional test is unable to detect all possible defects, especially timing-related faults. Open and short defects on interconnects between embedded modules can be detected by IDDT testing. Boundary Scan can provide accessibility to internal buses. A statistical analysis is presented discussing the uncertain factors due to process variations and power fluctuation. The effectiveness of the proposed technique on shorts, opens or the other non stuck-at fault type defects is also illustrated.