Full-Chip Interconnect Power Estimation and Simulation Considering Concurrent Repeater and Flip-Flop Insertion

  • Authors:
  • Weiping Liao;Lei He

  • Affiliations:
  • University of California, Los Angeles;University of California, Los Angeles

  • Venue:
  • Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
  • Year:
  • 2003

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Abstract

In this paper, we study the full-chip interconnect power modeling.We show that repeater insertion is no longer sufficient toachieve the target frequencies specified by ITRS, and develop concurrentrepeater and FF insertion schemes. Considering structuralinterconnects, layer assignment and concurrent repeater andFF insertion for delay specification, we develop a cycle-accuratemicroarchitecture-level interconnect power simulation. The simulationreduces the over-estimation by up to 2:46X compared topower estimation based on purely stochastic interconnects and fixedswitching factor. Furthermore, we show that interconnect pipelininghas a lower IPC but can improve throughput by up to 2.03X.This indicates that the traditional design flow optimizing IPC andclock frequency separately may no longer be valid.