Replacing global wires with an on-chip network: a power analysis

  • Authors:
  • Seongmoo Heo;Krste Asanović

  • Affiliations:
  • MIT Computer Science and Artificial Intelligence Laboratory, Cambridge, MA;MIT Computer Science and Artificial Intelligence Laboratory, Cambridge, MA

  • Venue:
  • ISLPED '05 Proceedings of the 2005 international symposium on Low power electronics and design
  • Year:
  • 2005

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Abstract

This paper explores the power implications of replacing global chip wires with an on-chip network. We optimize network links by varying repeater spacing, link pipelining, and voltage scaling, to significantly reduce the energy to send a bit across chip. We develop an analytic model of large chip designs with an on-chip two-dimensional mesh network and estimate the power savings possible in a 70 nm process for two different design points: a circuit-switched ASIC or FPGA design, and a dynamic packet-switched tiled architecture. For circuit-switched networks, achievable power savings are 35--50% for a mesh with 1 mm links. The packet switched designs use multiplexing and signal encoding to reduce the number of link wires required, but the router overhead limits peak wire power savings to around 20% with optimal tile sizes of around 2 mm