The interpretation and application of Rent's rule
IEEE Transactions on Very Large Scale Integration (VLSI) Systems - Special issue on system-level interconnect prediction
Addressing the system-on-a-chip interconnect woes through communication-based design
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Route packets, not wires: on-chip inteconnection networks
Proceedings of the 38th annual Design Automation Conference
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Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
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High-level power analysis for on-chip networks
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IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Approaching the theoretical limits of a mesh NoC with a 16-node chip prototype in 45nm SOI
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New heuristic algorithms for low-energy mapping and routing in 3D NoC
International Journal of Computer Applications in Technology
Silicon-aware distributed switch architecture for on-chip networks
Journal of Systems Architecture: the EUROMICRO Journal
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This paper explores the power implications of replacing global chip wires with an on-chip network. We optimize network links by varying repeater spacing, link pipelining, and voltage scaling, to significantly reduce the energy to send a bit across chip. We develop an analytic model of large chip designs with an on-chip two-dimensional mesh network and estimate the power savings possible in a 70 nm process for two different design points: a circuit-switched ASIC or FPGA design, and a dynamic packet-switched tiled architecture. For circuit-switched networks, achievable power savings are 35--50% for a mesh with 1 mm links. The packet switched designs use multiplexing and signal encoding to reduce the number of link wires required, but the router overhead limits peak wire power savings to around 20% with optimal tile sizes of around 2 mm