Reduction of coupling effects by optimizing the 3-D configuration of the routing grid

  • Authors:
  • Atsushi Sakai;Takashi Yamada;Yoshifumi Matsushita;Hiroto Yasuura

  • Affiliations:
  • Materials and Devices Development Center BU, Sanyo Electric Co., Ltd., Gifu 503-0195, Japan;Materials and Devices Development Center BU, Sanyo Electric Co., Ltd., Gifu 503-0195, Japan;Materials and Devices Development Center BU, Sanyo Electric Co., Ltd., Gifu 503-0195, Japan;Graduate School of Engineering Sciences, Kyushu University, Fukuoka 816-8580, Japan

  • Venue:
  • IEEE Transactions on Very Large Scale Integration (VLSI) Systems - Special section on low power
  • Year:
  • 2003

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Abstract

In this brief, we propose a new physical design technique for a subquarter micrometer system-on-a-chip (SoC). By optimizing the individual layer's routing grid space, coupling effects such as crosstalk noise, crosstalk-induced delay variations, and coupling power consumption are almost eliminated with little runtime penalty. Experiments are performed on the design of an image processing circuit using a subquarter micron CMOS process with multilayer interconnects. Simply by employing our proposed technique, the maximum delay and the power consumption can be decreased simultaneously by up to 15% and 10%, respectively, without any other process improvements.