Reducing cross-coupling among interconnect wires in deep-submicron datapath design

  • Authors:
  • Joon-Seo Yim;Chong-Min Kyung

  • Affiliations:
  • DSP Group, Information Technology Lab., LG Corporate Institute of Technology, 16, Woomyeon-Dong, Seocho-Gu, Seoul, 137-140, Korea;Department of Electrical Engineering, KAIST, 373-1, Kusong-Dong, Yusong-Gu, Taejon, 305-701, Korea

  • Venue:
  • Proceedings of the 36th annual ACM/IEEE Design Automation Conference
  • Year:
  • 1999

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Abstract