Using a Distributed Rectangle Bin-Packing Approach for Core-based SoC Test Scheduling with Power Constraints

  • Authors:
  • Yu Xia;Malgorzata Chrzanowska-Jeske;Benyi Wang;Marcin Jeske

  • Affiliations:
  • Portland State University, OR;Portland State University, OR;Portland State University, OR;Portland State University, OR

  • Venue:
  • Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
  • Year:
  • 2003

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Abstract

We present a new algorithm to co-optimize test scheduling andwrapper design under power constraints for core-based SoCs(System on Chip). Core testing solutions are generated as a set ofwrapper designs, each represented by a rectangle with width equalto the test time and height equal to the number of TAM (TestAccess Mechanism) wires used. The test-scheduling problem withpower constraints is formulated as the distributed rectangle bin-packingproblem, which allows wrapper pins to be assigned to non-consecutiveSoC pins. The generalized problem for multiple-TAMsis solved by global optimization using evolutionary strategy and thesequence-pair representation. Experiments on ITCý02 benchmarksare very encouraging.