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ICCAD '99 Proceedings of the 1999 IEEE/ACM international conference on Computer-aided design
Performance optimization under rise and fall parameters
ICCAD '99 Proceedings of the 1999 IEEE/ACM international conference on Computer-aided design
On the global fanout optimization problem
ICCAD '99 Proceedings of the 1999 IEEE/ACM international conference on Computer-aided design
Design of High-Performance Microprocessor Circuits
Design of High-Performance Microprocessor Circuits
Static leakage reduction through simultaneous threshold voltage and state assignment
Proceedings of the 40th annual Design Automation Conference
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IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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Proceedings of the 41st annual Design Automation Conference
Transistor and Pin Reordering for Gate Oxide Leakage Reduction in Dual T{ox} Circuits
ICCD '04 Proceedings of the IEEE International Conference on Computer Design
CMOS VLSI Design: A Circuits and Systems Perspective
CMOS VLSI Design: A Circuits and Systems Perspective
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IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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ISQED '06 Proceedings of the 7th International Symposium on Quality Electronic Design
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Proceedings of the conference on Design, automation and test in Europe: Proceedings
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IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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ACM Journal on Emerging Technologies in Computing Systems (JETC)
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Computers and Electrical Engineering
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Abstract-With continued and aggressive scaling, using ultralow thickness SiO2 for the transistor gates, tunneling current has emerged as the major component of leakage in CMOS circuits. In this paper, we propose a new approach called dual dielectrics of dual thicknesses (DKDT) for the reduction of both ON and OFF state gate tunneling currents. We claim that the simultaneous utilization of SiON and SiO2 each with multiple thicknesses is a better approach for gate leakage reduction than the conventional one that uses a single gate dielectric, SiO2, of multiple thicknesses. We develop an algorithm for the corresponding assignment of dual dielectric and dual thickness cells that minimizes the overall tunneling current for a circuit without compromising its performance. We performed extensive experiments on ISCAS驴85 benchmarks using 45 nm technology which demonstrate that our approach can reduce the tunneling current by as much as 98.7% on average 94.8%), without performance degradation.