Defect aware X-filling for low-power scan testing

  • Authors:
  • S. Balatsouka;V. Tenentes;X. Kavousianos;K. Chakrabarty

  • Affiliations:
  • University of Ioannina, Ioannina, Greece;University of Ioannina, Ioannina, Greece;University of Ioannina, Ioannina, Greece;Duke University, Durham, NC

  • Venue:
  • Proceedings of the Conference on Design, Automation and Test in Europe
  • Year:
  • 2010

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Abstract

Various X-filling methods have been proposed for reducing the shift and/or capture power in scan testing. The main drawback of these methods is that X-filling for low power leads to lower defect coverage than random-fill. We propose a unified low-power and defect-aware X-filling method for scan testing. The proposed method reduces shift power under constraints on the peak power during response capture, and the power reduction is comparable to that for the Fill-Adjacent X-filling method. At the same time, this approach provides high defect coverage, which approaches and in many cases is higher than that for random-fill, without increasing the pattern count. The advantages of the proposed method are demonstrated with simulation results for the largest ISCAS and the IWLS benchmark circuits.