A resilience roadmap: (invited paper)

  • Authors:
  • Sani R. Nassif;Nikil Mehta;Yu Cao

  • Affiliations:
  • IBM Corporation, Austin, TX;California Institute of Technology, Pasadena, CA;Arizona State University, Tempe, AZ

  • Venue:
  • Proceedings of the Conference on Design, Automation and Test in Europe
  • Year:
  • 2010

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Abstract

Technology scaling has an increasing impact on the resilience of CMOS circuits. This outcome is the result of (a) increasing sensitivity to various intrinsic and extrinsic noise sources as circuits shrink, and (b) a corresponding increase in parametric variability causing behavior similar to what would be expected with hard (topological) faults. This paper examines the issue of circuit resilience, then proposes and demonstrates a roadmap for evaluating fault rates starting at the 45nm and going down to the 12nm nodes. The complete infrastructure necessary to make these predictions is placed in the open source domain, with the hope that it will invigorate research in this area.