Wire packing: a strong formulation of crosstalk-aware chip-level track/layer assignment with an efficient integer programming solution

  • Authors:
  • Rony Kay;Rob A. Rutenbar

  • Affiliations:
  • Intel Corporation, Santa Clara, California;Dept. of ECE, Carnegie Mellon University, Pittsburgh, Pennsylvania

  • Venue:
  • ISPD '00 Proceedings of the 2000 international symposium on Physical design
  • Year:
  • 2000

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Abstract