Projection-based performance modeling for inter/intra-die variations

  • Authors:
  • Xin Li;Jiayong Le;L. T. Pileggi;A. Strojwas

  • Affiliations:
  • Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA;Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA;Dept. of Electr. Eng., California Univ., Riverside, CA, USA;Berkeley Design Autom., Santa Clara, CA, USA

  • Venue:
  • ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
  • Year:
  • 2005

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Abstract

Large-scale process fluctuations in nano-scale IC technologies suggest applying high-order (e.g., quadratic) response surface models to capture the circuit performance variations. Fitting such models requires significantly more simulation samples and solving much larger linear equations. In this paper, we propose a novel projection-based extraction approach, PROBE, to efficiently create quadratic response surface models and capture both inter-die and intra-die variations with affordable computation cost. PROBE applies a novel projection scheme to reduce the response surface modeling cost (i.e., both the required number of samples and the linear equation size) and make the modeling problem tractable even for large problem sizes. In addition, a new implicit power iteration algorithm is developed to find the optimal projection space and solve for the unknown model coefficients. Several circuit examples from both digital and analog circuit modeling applications demonstrate that PROBE can generate accurate response surface models while achieving up to 12/spl times/ speedup compared with the traditional methods.