Effects of global interconnect optimizations on performance estimation of deep submicron design

  • Authors:
  • Yu Cao;Chenming Hu;Xuejue Huang;Andrew B. Kahng;Sudhakar Muddu;Dirk Stroobandt;Dennis Sylvester

  • Affiliations:
  • UC Berkeley;UC Berkeley;UC Berkeley;UCLA;Silicon Graphics, Inc.;Ghent University, Belgium;Synopsys, Inc.

  • Venue:
  • Proceedings of the 2000 IEEE/ACM international conference on Computer-aided design
  • Year:
  • 2000

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Abstract

In this paper, we quantify the impact of global interconnect optimization techniques that address such design objectives as delay, peak noise, delay uncertainty due to noise, power, and cost. In doing so, we develop a new system-performance simulation model as a set of studies within the MARCO GSRC Technology Extrapolation (GTX) system. We model a typical point-to-point global interconnect and focus on accurate assessment of both circuit and design technology with respect to such issues as inductance, signal line shielding, dynamic delay, buffer placement uncertainty and repeater staggering. We demonstrate, for example, that optimal wire sizing models need to consider inductive effects -- and that use of more accurate {-1,3} worst-case capacitive coupling noise switch factors substantially increases peak noise estimates compared to traditional {0,2} bounds. We also find that optimal repeater sizes are significantly smaller than conventional models would suggest, especially when considering energy-delay issues.