Non-Scan Design for Testability for Synchronous Sequential Circuits Based on Conflict Analysis

  • Authors:
  • Dong Xiang;Yi Xu;Hideo Fujiwara

  • Affiliations:
  • -;-;-

  • Venue:
  • ITC '00 Proceedings of the 2000 IEEE International Test Conference
  • Year:
  • 2000

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Abstract

A non-scan design for testability y method is presented for synchronous sequential circuits. A testability measure called conflict based on conflict analysisin the process of synchronous sequential circuit testgeneration is introduced. Reconvergent fan outs withnonuniform in version parity is still one of the maincauses of redundancy and backtracking in the processof sequential circuit test generation. A new conceptcalled sequential depth for testability is introduced tocalculate the conflict-analysis-based testability measure Potential conflicts between fault effect activation and fault effect propagation are also checked because they are closely related. The testability measure implies the number of potential conflicts to occur or the number of clock cycles required to detecta fault. The non-scan design for testability methodbased on the conflict measure can reduce many potential back tracks make many hard-to-detect faultseasy-to-detect and many redundant faults testabletherefore, can enhance fault coverage of the circuitgreatly. It is believed that non-scan design for testability using the conflict measure can improve the actualtestability of a circuit. Extensive experimental resultsare presented to demonstrate the effectiveness of themethod.