Defect tolerance at the end of the roadmap

  • Authors:
  • Mahim Mishra;Seth C. Goldstein

  • Affiliations:
  • Computer Science Department, Carnegie Mellon University;Computer Science Department, Carnegie Mellon University

  • Venue:
  • Nano, quantum and molecular computing
  • Year:
  • 2004

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Abstract

As feature sizes shrink closer to single digit nanometer dimensions, defect tolerance will become increasingly important. This is true whether the chips are manufactured using top-down methods, such as photolithography, or bottom-up assembly processes such as Chemically Assembled Electronic Nanotechnology (CAEN). In this chapter, we examine the consequences of this increased rate of defects, and describe a defect tolerance methodology centered around reconfigurable devices, a scalable testing method, and dynamic place-and-route. We summarize some of our own results in this area as well as those of others, and enumerate some future research directions required to make nanometer-scale computing a reality.