Fast interconnect synthesis with layer assignment

  • Authors:
  • Zhuo Li;Charles J. Alpert;Shiyan Hu;Tuhin Muhmud;Stephen T. Quay;Paul G. Villarrubia

  • Affiliations:
  • IBM Research, Austin, TX, USA;IBM Research, Austin, TX, USA;Michigan Technological University, Houghton, MI, USA;IBM Systems and Technology Group, Austin, TX, USA;IBM Systems and Technology Group, Austin, TX, USA;IBM Systems and Technology Group, Austin, TX, USA

  • Venue:
  • Proceedings of the 2008 international symposium on Physical design
  • Year:
  • 2008

Quantified Score

Hi-index 0.00

Visualization

Abstract

As technology scaling advances beyond 65 nanometer node, more devices can fit onto a chip, which implies continued growth of design size. The increased wire delay dominance due to finer wire widths makes design closure an increasingly challenging problem. Interconnect synthesis techniques, such as buffer insertion/sizing and wire sizing, have proven to be the critical part of a successful timing closure optimization tool. Layer assignment, which was traditionally treated as same as wire sizing, is more effective and friendly in the design flow than wire sizing in the advanced technologies. Techniques for simultaneous layer assignment and buffer insertion with resource control are increasingly important for the quality of results of interconnect synthesis. This paper outlines the importance of layer assignment over wire sizing, and presents efficient techniques to perform concurrent buffer insertion and layer assignment to fix the electrical and timing problems, while maintaining speed and efficient use of resources