Physical Design for 3D System on Package

  • Authors:
  • Sung Kyu Lim

  • Affiliations:
  • Georgia Institute of Technology

  • Venue:
  • IEEE Design & Test
  • Year:
  • 2005

Quantified Score

Hi-index 0.00

Visualization

Abstract

Systems on package constitute a specific class of 3D designs wherein multiple manufactured die are stacked atop one another in a package that embeds both active and passive components. This article considers the problem of physical design for such an environment.