Testing for Resistive Opens and Stuck Opens

  • Authors:
  • James C. -M. Li;Chao-Wen Tseng;E. J. McCluskey

  • Affiliations:
  • -;-;-

  • Venue:
  • ITC '01 Proceedings of the 2001 IEEE International Test Conference
  • Year:
  • 2001

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Abstract

This paper studies the behavior of stuck andresistive open defects. The effects on test results ofthree test conditions (supply voltage, speed,temperature) as well as test patterns applied areevaluated. Diagnosis schemes for stuck and resistiveopens are also presented. Five Murphy chips arediagnosed as having stuck open defects and one chip isdiagnosed as having a resistive open defect. Theirexperimental data match our expectations for stuckopens and resistive opens.