Stuck-Fault Tests vs. Actual Defects

  • Authors:
  • Edward J. McCluskey;Chao-Wen Tseng

  • Affiliations:
  • -;-

  • Venue:
  • ITC '00 Proceedings of the 2000 IEEE International Test Conference
  • Year:
  • 2000

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Abstract

This paper studies some manufacturing test datacollected for an experimental digital IC. Test resultsfor a large variety of single-stuck fault based test setsare shown and compared with a number of test setsbased on other fault models. The defects present in thechips studied are characterized based on the chip testerresponses. The data presented shows that N-detect testsets are particularly effective for both timing and hardfailures. In these test sets each single-stuck fault isdetected by at least N different test patterns.We also present data on the use of IDDq tests andVLV (very low voltage) tests for detecting defects whosepresence doesn't interfere with normal operationduring manufacturing test, but which cause early lifefailure.