Improved Wafer-level Spatial Analysis for IDDQ Limit Setting

  • Authors:
  • Sagar Sabade;D. M. H. Walker

  • Affiliations:
  • -;-

  • Venue:
  • ITC '01 Proceedings of the 2001 IEEE International Test Conference
  • Year:
  • 2001

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Abstract

This paper proposes a new ethodology for esti ating theupper bound on the IDDQ of defect free chips by using waferlevel spatial infor ation.This can be used for IDDQSEMATECH data.Such a methodology accounts for thechange in IDDQ due to process variations across wafers andreduces false rejects resulting in yield loss.Typicalscenarios in using this approach are discussed.The resultsare compared with traditional methods.