Manufacturing-Aware Physical Design

  • Authors:
  • Puneet Gupta;Andrew B. Kahng

  • Affiliations:
  • UC San Diego, La Jolla;UC San Diego, La Jolla

  • Venue:
  • Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
  • Year:
  • 2003

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Abstract

Ultra-deep submicron manufacturability impacts physicaldesign (PD) through complex layout rules and large guardbands for process variability; this creates new requirements for new manufacturing-aware PD technologies. The firstpart of this tutorial reviews PD complications and methodology changes - notably in the detailed routing arena - that arise from subwavelength lithography and deep-submicronmanufacturing (antennas, metal planarization and mask-wafer mismatch). Process variations and their sources are taxonomized for modeling and simulation. A framework ofdesign for cost and value is described. The second part covers yield-constrained optimizations in PD, especially "beyond corners" approaches that escape today's pessimistic or even incorrect corner-based approaches. Statistical timingand noise analyses enable optimization of parametric yieldand reliability. Yield-aware cell libraries and "analog" design rules (as opposed to "digital", 0/1 rules) can help designers explore yield-cost tradeoffs, especially for low-volumeparts. We then examine performance impact-limited fill insertion which goes beyond mere capacitance rules. Modeling, objectives, and filling strategies are discussed. Finally,we discuss current and near-term prospects for the overall design-to-manufacturing PD methodology. Key aspects include better integrations with analysis and manufacturing interfaces, as well as cost-benefit tradeoffs for "regular"layout structures that are likely beyond 90nm, cost optimizations for low-volume production, and the role of robust and/or stochastic optimization in PD.